Invention Grant
- Patent Title: Light-emitting diode device
- Patent Title (中): 发光二极管装置
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Application No.: US13016594Application Date: 2011-01-28
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Publication No.: US08592844B2Publication Date: 2013-11-26
- Inventor: Seiji Izutani , Kazutaka Hara , Takahiro Fukuoka , Hisae Uchiyama , Hitotsugu Hirano
- Applicant: Seiji Izutani , Kazutaka Hara , Takahiro Fukuoka , Hisae Uchiyama , Hitotsugu Hirano
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-018256 20100129; JP2010-090908 20100409; JP2010-161848 20100716; JP2010-161850 20100716; JP2010-172327 20100730
- Main IPC: H01L33/64
- IPC: H01L33/64
Abstract:
A light-emitting diode device includes a light-emitting diode, a power circuit portion for supplying electric power to the light-emitting diode, and a heat dissipating member for dissipating the heat generated from the light-emitting diode. The heat dissipating member is made of a thermal conductive sheet which contains a plate-like boron nitride particle. The thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.
Public/Granted literature
- US20110260185A1 LIGHT-EMITTING DIODE DEVICE Public/Granted day:2011-10-27
Information query
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