Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13669056Application Date: 2012-11-05
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Publication No.: US08592896B2Publication Date: 2013-11-26
- Inventor: Yoshimitsu Murase , Kenya Kobayashi , Atsushi Kaneko , Hideo Yamamoto
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2006-331619 20061208
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device includes a semiconductor layer of a second conductive type, a first diffused region of a first conductive type formed in the semiconductor layer, a second diffused region of the second conductive type selectively formed in the first diffused region, a trench formed in the semiconductor layer, a gate electrode housed in the trench with a gate insulator intervening, a top surface of the gate electrode being lower than a top surface of the second diffused region, a first oxide film housed in the trench and formed over the gate electrode, a second oxide film housed in the trench and formed over the first oxide film, a third oxide film housed in the trench and formed over the second oxide film, and a source electrode formed over the third oxide film and electrically connecting to the first and second diffused regions.
Public/Granted literature
- US20130062689A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-03-14
Information query
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