Invention Grant
- Patent Title: Semiconductor body with a protective structure and method for manufacturing the same
- Patent Title (中): 具有保护结构的半导体体及其制造方法
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Application No.: US13119759Application Date: 2009-09-16
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Publication No.: US08592910B2Publication Date: 2013-11-26
- Inventor: Hubert Enichlmair
- Applicant: Hubert Enichlmair
- Applicant Address: AT Unterpremstaetten
- Assignee: AMS AG
- Current Assignee: AMS AG
- Current Assignee Address: AT Unterpremstaetten
- Agency: McDermott Will & Emery LLP
- Priority: DE102008047850 20080918
- International Application: PCT/EP2009/062029 WO 20090916
- International Announcement: WO2010/031798 WO 20100325
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L29/72 ; H01L29/74 ; H01L31/111 ; H01L29/73

Abstract:
A semiconductor body includes a protective structure. The protective structure (10) includes a first and a second region (11, 12) which have a first conductivity type and a third region (13) that has a second conductivity type. The second conductivity type is opposite the first conductivity type. The first and the second region (11, 12) are arranged spaced apart in the third region (13), so that a current flow from the first region (11) to the second region (12) is made possible for the limiting of a voltage difference between the first and the second region (11, 12). The protective structure includes an insulator (14) that is arranged on the semiconductor body (9) and an electrode (16) that is constructed with floating potential and is arranged on the insulator (14).
Public/Granted literature
- US20110298104A1 Semiconductor Body with a Protective Structure and Method for Manufacturing the Same Public/Granted day:2011-12-08
Information query
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