Invention Grant
- Patent Title: Transistor device and a method of manufacturing the same
- Patent Title (中): 晶体管器件及其制造方法
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Application No.: US12477809Application Date: 2009-06-03
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Publication No.: US08592922B2Publication Date: 2013-11-26
- Inventor: Jacob C. Hooker , Markus Mueller
- Applicant: Jacob C. Hooker , Markus Mueller
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Priority: EP08104324 20080609
- Main IPC: H01L21/77
- IPC: H01L21/77

Abstract:
A transistor device is provided that includes a substrate, a first channel region formed in a first portion of the substrate and being doped with a dopant of a first type of conductivity, a second channel region formed in a second portion of the substrate and being doped with a dopant of a second type of conductivity, a gate insulating layer formed on the first channel region and on the second channel region, a dielectric capping layer formed on the gate insulating layer, a first gate region formed on the dielectric capping layer over the first channel region, and a second gate region formed on the dielectric capping layer over the second channel region, wherein the first gate region and the second gate region are made of the same material, and wherein one of the first gate region and the second gate region comprises an ion implantation.
Public/Granted literature
- US20100044798A1 TRANSISTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-02-25
Information query
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