Invention Grant
- Patent Title: Integrated circuit package system with bump over via
- Patent Title (中): 集成电路封装系统，具有通孔通孔
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Application No.: US11673558Application Date: 2007-02-09
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Publication No.: US08592989B2Publication Date: 2013-11-26
- Inventor: Guichea Na , Soohan Park , Gwangjin Kim
- Applicant: Guichea Na , Soohan Park , Gwangjin Kim
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An integrated circuit package system includes a substrate, forming a resist layer having an elongated recess over the substrate, forming a via in the substrate below the elongated recess, and forming an elongated bump in the elongated recess over the via.
Public/Granted literature
- US20080191345A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP OVER VIA Public/Granted day:2008-08-14
Information query
IPC分类:
