Invention Grant
- Patent Title: Backlight module and heatsink apparatus
- Patent Title (中): 背光模块和散热装置
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Application No.: US13583221Application Date: 2012-08-31
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Publication No.: US08593041B1Publication Date: 2013-11-26
- Inventor: Zexin Wu
- Applicant: Zexin Wu
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: Shenzhen China Star Optoelectronics Technology co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Technology co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Andrew C. Chang
- Priority: CN201210310371 20120828
- International Application: PCT/CN2012/080840 WO 20120831
- Main IPC: H01J1/02
- IPC: H01J1/02

Abstract:
The present invention discloses a heatsink apparatus for use with a backlight module. The heatsink apparatus is used to dissipate heat buildup from a light source, and includes a heatsink and a backframe. The heatsink is thermally in contact with the light source. The backframe and the heatsink jointly define a ventilation shaft on a surface of the backframe. The present invention further includes a backlight module incorporated with the heatsink. With the provision of the ventilation shaft of the heatsink, the performance of the heat dissipation is increased, and the service life of the light source is therefore prolonged.
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