Invention Grant
US08593166B2 Semiconductor wafer, semiconductor circuit, substrate for testing and test system
失效
半导体晶圆,半导体电路,测试和测试系统基板
- Patent Title: Semiconductor wafer, semiconductor circuit, substrate for testing and test system
- Patent Title (中): 半导体晶圆,半导体电路,测试和测试系统基板
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Application No.: US12957168Application Date: 2010-11-30
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Publication No.: US08593166B2Publication Date: 2013-11-26
- Inventor: Daisuke Watanabe , Toshiyuki Okayasu
- Applicant: Daisuke Watanabe , Toshiyuki Okayasu
- Applicant Address: JP Tokyo
- Assignee: Advantest Corporation
- Current Assignee: Advantest Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
A test system includes a test substrate that transmits/receives signals to/from a semiconductor wafer, and a control apparatus to control the test substrate. The semiconductor wafer includes an external terminal coupled to an external measurement circuit, a plurality of selecting wiring lines provided to receive/transmit signals to/from the corresponding the measuring points, and a selecting section that selects one of the selecting wiring lines and that allows signal transmission between the corresponding measuring point and the external terminal through the selected selecting wiring line. The test substrate includes a measurement circuit that is coupled to the external terminal of the semiconductor wafer and that measures an electrical characteristic of a signal transmitted through the selecting wiring line selected by the selecting section, and a control section that controls which one of the measurement wiring lines is to be selected by the selecting section in the semiconductor wafer.
Public/Granted literature
- US20110148454A1 SEMICONDUCTOR WAFER, SEMICONDUCTOR CIRCUIT, SUBSTRATE FOR TESTING AND TEST SYSTEM Public/Granted day:2011-06-23
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