Invention Grant
- Patent Title: Localized temperature stability of low temperature cofired ceramics
- Patent Title (中): 低温共烧陶瓷的局部温度稳定性
-
Application No.: US13245535Application Date: 2011-09-26
-
Publication No.: US08593237B1Publication Date: 2013-11-26
- Inventor: Steven Xunhu Dai
- Applicant: Steven Xunhu Dai
- Applicant Address: US NM Albuquerque
- Assignee: Sandia Corporation
- Current Assignee: Sandia Corporation
- Current Assignee Address: US NM Albuquerque
- Agent Kevin W. Bieg
- Main IPC: H01P7/08
- IPC: H01P7/08
Abstract:
The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency.
Information query
