Invention Grant
- Patent Title: Flexible printed wiring board and electronic apparatus
- Patent Title (中): 柔性印刷线路板和电子设备
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Application No.: US13016568Application Date: 2011-01-28
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Publication No.: US08593820B2Publication Date: 2013-11-26
- Inventor: Daigo Suzuki , Gen Fukaya
- Applicant: Daigo Suzuki , Gen Fukaya
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2010-150339 20100630
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
According to one embodiment, the flexible printed wiring board of the one embodiment has a base, corrugated portion, and block. The base has therein a conductor that electrically connects a first end and a second end. The corrugated portion is formed in a middle part of the base and has a ridge and legs. The ridge is roundly bent. The legs continuously hang from opposite sides of the ridge. The block is located off the ridge within a gap where the legs face each other and is mounted on one of the legs.
Public/Granted literature
- US20120002376A1 Flexible Printed Wiring Board and Electronic Apparatus Public/Granted day:2012-01-05
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