Invention Grant
- Patent Title: Suspension board with circuit
- Patent Title (中): 悬挂板带电路
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Application No.: US12588728Application Date: 2009-10-26
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Publication No.: US08593823B2Publication Date: 2013-11-26
- Inventor: Tetsuya Ohsawa , Hayato Abe , Yoshinari Yoshida
- Applicant: Tetsuya Ohsawa , Hayato Abe , Yoshinari Yoshida
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards
- Priority: JP2008-282165 20081031
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.
Public/Granted literature
- US20100110649A1 Suspension board with circuit Public/Granted day:2010-05-06
Information query
