Invention Grant
- Patent Title: Compressible engagement assembly
- Patent Title (中): 可压缩接合组件
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Application No.: US12638295Application Date: 2009-12-15
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Publication No.: US08593827B1Publication Date: 2013-11-26
- Inventor: Jeffrey Michael Lewis , Joseph P. King
- Applicant: Jeffrey Michael Lewis , Joseph P. King
- Applicant Address: US MA Hopkinton
- Assignee: EMC Corporation
- Current Assignee: EMC Corporation
- Current Assignee Address: US MA Hopkinton
- Agency: Holland & Knight LLP
- Agent Brian J. Colandreo; Mark H. Whittenberger
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/18

Abstract:
A compressible engagement assembly includes a latching assembly configured to releasably engage a rack assembly. A compressible member is configured to be compressed by the latching assembly when the latching assembly is releasably engaged with the rack assembly. The compressible member is further configured to engage a rackmount component removably positioned within the rack assembly.
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