Invention Grant
US08593854B1 Structure and method for forming conductive path in resistive random-access memory device
有权
在电阻随机存取存储器件中形成导电路径的结构和方法
- Patent Title: Structure and method for forming conductive path in resistive random-access memory device
- Patent Title (中): 在电阻随机存取存储器件中形成导电路径的结构和方法
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Application No.: US13476366Application Date: 2012-05-21
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Publication No.: US08593854B1Publication Date: 2013-11-26
- Inventor: Yue-Der Chih , Luan Conn Tran
- Applicant: Yue-Der Chih , Luan Conn Tran
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
An array and forming method for resistive-RAM (RRAM) devices provides for the simultaneous selection of multiple bit cells and the simultaneous forming of the RRAM resistive elements within the selected bit cells. The bit cells each include a resistive element and a transistor and are arranged vertically along vertical bit lines. The resistive elements of the bit cells are coupled to source lines that are parallel to word lines and perpendicular to the vertical bit lines. The bit lines are maintained at different biases. A high voltage is applied to one of the source lines coupled to adjacent resistive elements of bit cells disposed along more than one vertical bit line. When the associated transistors are turned on by a sufficiently high gate voltage, the desired RRAM resistive elements along one of the bit lines are formed without stressing other bit cells of the array.
Public/Granted literature
- US20130308367A1 STRUCTURE AND METHOD FOR FORMING CONDUCTIVE PATH IN RESISTIVE RANDOM-ACCESS MEMORY DEVICE Public/Granted day:2013-11-21
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