Invention Grant
- Patent Title: Circuit arrangement, apparatus and process for the serial sending of data via a connection contact
- Patent Title (中): 通过连接触点串行发送数据的电路布置,装置和过程
-
Application No.: US12370702Application Date: 2009-02-13
-
Publication No.: US08594225B2Publication Date: 2013-11-26
- Inventor: Thilo Rubehn , Joachim Ritter , Gert Umbach , Dieter Baecher , Wolfgang Horn , Joerg Franke
- Applicant: Thilo Rubehn , Joachim Ritter , Gert Umbach , Dieter Baecher , Wolfgang Horn , Joerg Franke
- Applicant Address: DE Freiburg
- Assignee: Micronas GmbH
- Current Assignee: Micronas GmbH
- Current Assignee Address: DE Freiburg
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: EP08005967 20080328
- Main IPC: H04L27/00
- IPC: H04L27/00

Abstract:
The invention relates to an integrated circuit arrangement with connection contacts for the serial exchange of data and/or signals with external components and apparatuses and with a control apparatus and/or a serial interface for the clocked receiving of data by means of a signal voltage on such a connection contact, which voltage is modulated between at least one low, one middle and one high voltage state. The control apparatus and/or the interface are designed in such a manner that data is sent in a sending mode via the connection contact in that the switching apparatus, after having received a slope changing in particular from the middle voltage state into in particular the higher or the lower voltage state, pulls the voltage state into the in particular opposite lower or higher voltage state. Furthermore, the invention relates to an apparatus and a process for operating such a circuit arrangement.
Public/Granted literature
- US20090252210A1 CIRCUIT ARRANGEMENT, APPARATUS AND PROCESS FOR THE SERIAL SENDING OF DATA VIA A CONNECTION CONTACT Public/Granted day:2009-10-08
Information query