Invention Grant
- Patent Title: Method for analyzing the structure of an electrically conductive object
- Patent Title (中): 用于分析导电物体的结构的方法
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Application No.: US12451944Application Date: 2008-06-06
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Publication No.: US08594780B2Publication Date: 2013-11-26
- Inventor: Wei Wang
- Applicant: Wei Wang
- Agency: Ware, Fressola, Maguire & Barber LLP
- Priority: GB0710949.9 20070607
- International Application: PCT/GB2008/001982 WO 20080606
- International Announcement: WO2008/149125 WO 20081211
- Main IPC: A61B5/00
- IPC: A61B5/00

Abstract:
A method for analyzing the structure of an electrically conductive object, the method comprising the steps of: (i) obtaining electrical impedance data for the object over a range of frequencies; (ii) analyzing the obtained electrical impedance data using a transfer function of an assumed electrical model to determine a plurality of electrical impedance properties for the object; (iii) constructively combining selected ones of the determined plurality of electrical impedance properties to provide at least one parametric impedance value for the object; and (iii) imaging one or more of the determined parametric impedance values.
Public/Granted literature
- US20100268109A1 METHOD FOR ANALYZING THE STRUCTURE OF AN ELECTRICALLY CONDUCTIVE OBJECT Public/Granted day:2010-10-21
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