Invention Grant
- Patent Title: Modulized heat-dissipation control method for datacenter
- Patent Title (中): 数据中心的模块化散热控制方法
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Application No.: US13118936Application Date: 2011-05-31
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Publication No.: US08594857B2Publication Date: 2013-11-26
- Inventor: Chih-Chien Lin , Chien-An Chen
- Applicant: Chih-Chien Lin , Chien-An Chen
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW99141057A 20101126
- Main IPC: G05D23/00
- IPC: G05D23/00 ; F28F7/00 ; F28D15/00

Abstract:
A modulized heat-dissipation control method for a datacenter is provided. In this method, a temperature sensor is used to sense inner temperatures of multiple servers and CPU temperatures in the multiple servers. If any one of the CPU temperatures is abnormal, a flow of a first coolant is adjusted. If any one of the inner temperatures is abnormal, a rotating speed of a fan module is adjusted. If the rotating speed of the fan module has reached its maximum, a flow of a second coolant is adjusted.
Public/Granted literature
- US20120136487A1 MODULIZED HEAT-DISSIPATION CONTROL METHOD FOR DATACENTER Public/Granted day:2012-05-31
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