Invention Grant
US08594975B2 Systems and methods for wafer edge feature detection and quantification
有权
晶圆边缘特征检测和量化的系统和方法
- Patent Title: Systems and methods for wafer edge feature detection and quantification
- Patent Title (中): 晶圆边缘特征检测和量化的系统和方法
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Application No.: US13028074Application Date: 2011-02-15
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Publication No.: US08594975B2Publication Date: 2013-11-26
- Inventor: Haiguang Chen , Jaydeep Sinha
- Applicant: Haiguang Chen , Jaydeep Sinha
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01B3/22
- IPC: G01B3/22
Abstract:
Disclosed herein is a method to enhance detection and quantification of features in the wafer edge/wafer roll off regions. Modifications and improvements have been made to earlier methods which enable improved accuracy and increased scope of feature detection.
Public/Granted literature
- US20110218762A1 SYSTEMS AND METHODS FOR WAFER EDGE FEATURE DETECTION AND QUANTIFICATION Public/Granted day:2011-09-08
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