Invention Grant
- Patent Title: On-chip thermal management techniques using inter-processor time dependent power density data for indentification of thermal aggressors
- Patent Title (中): 片上热管理技术使用处理器间时间依赖的功率密度数据来识别热攻击者
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Application No.: US13290456Application Date: 2011-11-07
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Publication No.: US08595525B2Publication Date: 2013-11-26
- Inventor: Jon J. Anderson , Victor A. Chiriac , Sorin A. Dobre , Maria G. Lupetini , Joseph V. Zanotelli
- Applicant: Jon J. Anderson , Victor A. Chiriac , Sorin A. Dobre , Maria G. Lupetini , Joseph V. Zanotelli
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Nicholas A. Cole
- Main IPC: G06F1/32
- IPC: G06F1/32

Abstract:
Various embodiments of methods and systems for controlling and/or managing thermal energy generation on a portable computing device are disclosed. Data discarded from one or more processing core registers may be monitored and analyzed to deduce individual workloads that have been processed by each of the cores over a unit of time. From the deduced workloads, the power consumed by each of the cores over the unit of time in order to process the workload can be calculated. Subsequently, a time dependent power density map can be created which reflects a historical and near real time power consumption for each core. Advantageously, because power consumption can be correlated to thermal energy generation, the TDPD map can be leveraged to identify thermal aggressors for targeted, fine grained application of thermal mitigation techniques. In some embodiments, workloads may be reallocated from the identified thermal aggressors to the identified underutilized processing components.
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