Invention Grant
- Patent Title: Low overhead dynamic thermal management in many-core cluster architecture
- Patent Title (中): 多核心集群架构中的低开销动态热管理
-
Application No.: US12698545Application Date: 2010-02-02
-
Publication No.: US08595731B2Publication Date: 2013-11-26
- Inventor: Pradip Bose , Philip G. Emma , Eren Kursun , Jude A. Rivers
- Applicant: Pradip Bose , Philip G. Emma , Eren Kursun , Jude A. Rivers
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Gall H. Zarick, Esq.
- Main IPC: G06F9/46
- IPC: G06F9/46 ; G06F9/44

Abstract:
A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution.
Public/Granted literature
- US20110191776A1 LOW OVERHEAD DYNAMIC THERMAL MANAGEMENT IN MANY-CORE CLUSTER ARCHITECTURE Public/Granted day:2011-08-04
Information query