Invention Grant
- Patent Title: Device for removing adhered substances
- Patent Title (中): 去除附着物的装置
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Application No.: US13106198Application Date: 2011-05-12
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Publication No.: US08595891B2Publication Date: 2013-12-03
- Inventor: Yoshihiro Okamoto , Mitsuhiro Takeda , Takashi Kawamoto
- Applicant: Yoshihiro Okamoto , Mitsuhiro Takeda , Takashi Kawamoto
- Applicant Address: JP Hirakata-shi
- Assignee: Sawa Corporation
- Current Assignee: Sawa Corporation
- Current Assignee Address: JP Hirakata-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-110954 20100513
- Main IPC: A47L5/38
- IPC: A47L5/38

Abstract:
A adhered substance removing device of the present disclosure includes a suction removal unit configured to suck and remove a liquid medium with which a wiping sheet is impregnated and adhered substances which is separated from the wiping sheet by an oscillation unit and re-adhered to a surface of the wiping sheet. The suction removal unit includes a cylindrical suction nozzle having inlet holes in a surface along which the wiping sheet is guided. and a suction pump configured to suck air from the suction nozzle. The Suction pump is connected to the suction nozzle, and a lid is detachably attached to an opening of the suction nozzle.
Public/Granted literature
- US20110277268A1 DEVICE FOR REMOVING ADHERED SUBSTANCES Public/Granted day:2011-11-17
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