Invention Grant
- Patent Title: Electrical system enclosure
- Patent Title (中): 电气系统外壳
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Application No.: US13435298Application Date: 2012-03-30
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Publication No.: US08595900B2Publication Date: 2013-12-03
- Inventor: Jozef Zbigniew Bedkowski , Johan Rene Sylvain De Cuyper
- Applicant: Jozef Zbigniew Bedkowski , Johan Rene Sylvain De Cuyper
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Cantor Colburn LLP
- Main IPC: E05D15/50
- IPC: E05D15/50

Abstract:
A door hinge includes a hinge body, a hinge pin, and a hinge base. The hinge body includes a first channel that defines a first axis, the hinge body further includes a slot formed therethrough at an angle to the first axis, and the hinge body further includes a retention apparatus arranged within the slot. The hinge pin is operatively disposed in the first channel and configured to travel along the first axis, the hinge pin includes at least three retention formations formed thereon, a first retention formation defines a first retention position, a second retention formation defines a second retention position, a third retention formation defines a third retention position, and the retention apparatus is configured to engage the hinge pin at one of the at least three retention formations. The hinge base includes a second channel configured to operatively receive at least a portion of the hinge pin.
Public/Granted literature
- US20130257248A1 ELECTRICAL SYSTEM ENCLOSURE Public/Granted day:2013-10-03
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