Invention Grant
- Patent Title: Method of manufacturing through electrode-attached glass substrate
- Patent Title (中): 通过电极附着的玻璃基板制造方法
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Application No.: US13135497Application Date: 2011-07-07
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Publication No.: US08596092B2Publication Date: 2013-12-03
- Inventor: Noboru Kawai
- Applicant: Noboru Kawai
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2010-156170 20100708
- Main IPC: C03C27/02
- IPC: C03C27/02

Abstract:
In a method of manufacturing a through electrode-attached glass substrate, electrode through holes and at least one dummy through hole are formed in a plate-shaped glass, and electrode members are inserted into the electrode through holes but not into the at least one dummy through-hole. The plate-shaped glass and the electrode members are welded by heating the plate-shaped glass at a temperature higher than a softening point of the plate-shaped glass so that the glass is allowed to flow into the at least one dummy through hole. Opposite surfaces of the plate-shaped glass are ground together with the electrode members so as to expose the electrode members to the opposite surfaces of the plate-shaped glass and to configure the electrode members as through electrodes that are electrically separated from each other.
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