Invention Grant
- Patent Title: Enhanced two phase flow in heat transfer systems
- Patent Title (中): 传热系统增强两相流
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Application No.: US12133970Application Date: 2008-06-05
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Publication No.: US08596341B2Publication Date: 2013-12-03
- Inventor: Ward E. Tegrotenhuis , Paul H. Humble , Curt A. Lavender , Dustin D. Caldwell
- Applicant: Ward E. Tegrotenhuis , Paul H. Humble , Curt A. Lavender , Dustin D. Caldwell
- Applicant Address: US WA Richland
- Assignee: Battelle Memorial Institute
- Current Assignee: Battelle Memorial Institute
- Current Assignee Address: US WA Richland
- Agent Derek H. Maughan; A. J. Gokcek
- Main IPC: F28D15/04
- IPC: F28D15/04

Abstract:
A family of structures and designs for use in devices such as heat exchangers so as to allow for enhanced performance in heat exchangers smaller and lighter weight than other existing devices. These structures provide separate flow paths for liquid and vapor and are generally open. In some embodiments of the invention, these structures can also provide secondary heat transfer as well. In an evaporative heat exchanger, the inclusion of these structures and devices enhance the heat transfer coefficient of the evaporation phase change process with comparable or lower pressure drop.
Public/Granted literature
- US20090321053A1 Enhanced Two Phase Flow in Heat Transfer Systems Public/Granted day:2009-12-31
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