Invention Grant
- Patent Title: Component of wireless IC device and wireless IC device
- Patent Title (中): 无线IC器件和无线IC器件的组成部分
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Application No.: US12944099Application Date: 2010-11-11
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Publication No.: US08596545B2Publication Date: 2013-12-03
- Inventor: Noboru Kato , Jun Sasaki
- Applicant: Noboru Kato , Jun Sasaki
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-139717 20080528
- Main IPC: G06K19/06
- IPC: G06K19/06 ; H01L23/02
Abstract:
A component of a wireless IC device includes a wireless IC chip and a feeding circuit substrate including a plurality of laminated resin layers. The wireless IC chip is included inside the feeding circuit substrate, and an annular electrode is arranged inside the feeding circuit substrate. The component of a wireless IC device and the radiation plate define the wireless IC device.
Public/Granted literature
- US20110062244A1 COMPONENT OF WIRELESS IC DEVICE AND WIRELESS IC DEVICE Public/Granted day:2011-03-17
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