Invention Grant
US08596743B2 Liquid ejecting head, liquid ejecting head unit, liquid ejecting apparatus and method of manufacturing liquid ejecting head
有权
液体喷射头，液体喷射头单元，液体喷射装置和液体喷射头的制造方法
- Patent Title: Liquid ejecting head, liquid ejecting head unit, liquid ejecting apparatus and method of manufacturing liquid ejecting head
- Patent Title (中): 液体喷射头，液体喷射头单元，液体喷射装置和液体喷射头的制造方法
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Application No.: US13045789Application Date: 2011-03-11
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Publication No.: US08596743B2Publication Date: 2013-12-03
- Inventor: Shigeki Suzuki , Katsuhiro Okubo
- Applicant: Shigeki Suzuki , Katsuhiro Okubo
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-079650 20100330
- Main IPC: B41J29/38
- IPC: B41J29/38 ; B41J2/015 ; B41J2/135
Abstract:
The circuit board holding section between the first and second holding members is sealed by an adhesive in an area other than an area where a connection wiring is connected to the circuit board, the first and second holding members are fixed to each other by engaging engaging claws, which are provided in two or more side surfaces at the outer circumference of one of the first and second holding members, with the other holding member, and the first and second holding members are fixed to each other by screw members.
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