A cross section of each divided light guiding plate is formed in a wedge shape, a step is formed at a portion of each divided light guiding plate where LEDs are arranged, and holes used for accommodating the LEDs are formed at the step. A plated face is formed on a lower face of each LED, and is coupled to a wiring substrate through solder. Each LED includes a light-emitting face, a lower frame, and an upper frame. The height of the lower frame of each LED is larger than the height of the upper frame, so that a lower end of the light-emitting face of each LED can be always located higher than a lower end of the divided light guiding plate.