Invention Grant
- Patent Title: Method and device for producing cuts in a transparent material
- Patent Title (中): 用于生产透明材料切割的方法和装置
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Application No.: US10566008Application Date: 2004-06-29
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Publication No.: US08597281B2Publication Date: 2013-12-03
- Inventor: Mark Bischoff , Dirk Mühlhoff , Mario Gerlach , Carsten Lang , Markus Sticker , Michael Bergt
- Applicant: Mark Bischoff , Dirk Mühlhoff , Mario Gerlach , Carsten Lang , Markus Sticker , Michael Bergt
- Applicant Address: DE Jena
- Assignee: Carl Zeiss Meditec AG
- Current Assignee: Carl Zeiss Meditec AG
- Current Assignee Address: DE Jena
- Agency: Patterson Thuente Pedersen, P.A.
- Priority: DE10334109 20030725
- International Application: PCT/EP2004/007045 WO 20040629
- International Announcement: WO2005/018516 WO 20050303
- Main IPC: A61F9/01
- IPC: A61F9/01

Abstract:
The invention relates to a method for producing cuts in a transparent material, in particular in the cornea, by creating optical openings in said material by means of laser radiation that is focused in said material, whereby the focal point is displaced in order to produce the cut from a surface grid-type array of optical openings arranged in sequence. The focal point is displaced along a trajectory and optical openings along said trajectory that are adjacent are not produced immediately after one another. In addition, the surface grid-type array of optical openings is constructed from at least two sub-grids, the optical openings of which are processed sequentially grid by grid.
Public/Granted literature
- US20080243109A1 Method and Device for Producing Cuts in a Transparent Material Public/Granted day:2008-10-02
Information query
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