Invention Grant
- Patent Title: Abrasive compact with improved machinability
- Patent Title (中): 具有改善机械加工性的磨粒
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Application No.: US13748934Application Date: 2013-01-24
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Publication No.: US08597387B2Publication Date: 2013-12-03
- Inventor: Steven W. Webb
- Applicant: Diamond Innovations, Inc.
- Applicant Address: US OH Worthington
- Assignee: Diamond Innovations, Inc.
- Current Assignee: Diamond Innovations, Inc.
- Current Assignee Address: US OH Worthington
- Agent Frank Y. Gao, Esq
- Main IPC: B24D3/04
- IPC: B24D3/04 ; B24D3/14 ; B24D3/34
Abstract:
An abrasive compact may include an ultra-hard phase that may include ultra-hard particles having a Knoop hardness of 5000 KHN or greater, a sinter catalyst, and a reaction phase that may include a catalyst-ceramic compound having a Knoop hardness lower than that of the ultra-hard phase.
Public/Granted literature
- US20130133269A1 ABRASIVE COMPACT WITH IMPROVED MACHINABILITY Public/Granted day:2013-05-30
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