Invention Grant
- Patent Title: Bonding method for laminated piezoelectric element
- Patent Title (中): 层压压电元件的接合方法
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Application No.: US12070517Application Date: 2008-02-19
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Publication No.: US08597457B2Publication Date: 2013-12-03
- Inventor: Tsukasa Yamada , Toyoki Tanaka
- Applicant: Tsukasa Yamada , Toyoki Tanaka
- Applicant Address: JP Tokyo
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2007-038855 20070220
- Main IPC: H01L41/22
- IPC: H01L41/22 ; H01L41/083

Abstract:
A laminated piezoelectric element includes plural internal electrodes which are laminated and a dead area at outer regions thereof. The laminated piezoelectric element has first and second end surfaces in an expansion direction thereof. In bonding a first bonded surface of a piezoelectric element fixing portion to the first end surface, a bonding method includes forming a first adhesive accumulation in the first bonded surface, accumulating an adhesive agent in the first adhesive accumulation, and bonding the first end surface to the first bonded surface. In bonding a vibration friction element to the second end surface, the bonding method includes forming, in a second bonded surface of the vibration friction element, a positioning guide hole for guiding the second end surface of the laminated piezoelectric element and a second adhesive accumulation, accumulating the adhesive agent in the second adhesive accumulation, and bonding the second end surface to the vibration friction portion.
Public/Granted literature
- US20080196815A1 Bonding method for laminated piezoelectric element Public/Granted day:2008-08-21
Information query
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