Invention Grant
- Patent Title: Electronic device enclosure
- Patent Title (中): 电子设备外壳
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Application No.: US13482108Application Date: 2012-05-29
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Publication No.: US08598469B2Publication Date: 2013-12-03
- Inventor: Chung-Cheng Hsieh , Chieh-Chen Chen , Li-Ping Chen , Ying Gao
- Applicant: Chung-Cheng Hsieh , Chieh-Chen Chen , Li-Ping Chen , Ying Gao
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110415961 20111214
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K5/00
Abstract:
An electronic device enclosure includes a first cover, a second cover located below the first cover, and a bracket for receiving a disk drive. The second cover defining a hole and comprising a shielding panel covering the hole. The shielding panel is deformable to expose the hole, for the disk drive inserting into or being removed out of the bracket.
Public/Granted literature
- US20130153287A1 ELECTRONIC DEVICE ENCLOSURE Public/Granted day:2013-06-20
Information query
