Invention Grant
- Patent Title: Semiconductor device and its fabrication method
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13366313Application Date: 2012-02-04
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Publication No.: US08598594B2Publication Date: 2013-12-03
- Inventor: Kazuhiro Mochizuki , Takashi Ishigaki , Akihisa Terano , Tomonobu Tsuchiya
- Applicant: Kazuhiro Mochizuki , Takashi Ishigaki , Akihisa Terano , Tomonobu Tsuchiya
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2011-048728 20110307
- Main IPC: H01L29/205
- IPC: H01L29/205 ; H01L21/20

Abstract:
In a semiconductor device including a stack structure having heterojunction units formed by alternately stacking GaN (gallium nitride) films and barrier films which are different in forbidden band width, a first electrode formed in a Schottky barrier contact with one sidewall of the stack structure, and a second electrode formed in contact with the other sidewall, an oxide film is interposed between the first electrode and the barrier films. Therefore, the reverse leakage current is prevented from flowing through defects remaining in the barrier films due to processing of the barrier films, so that a reverse leakage current of a Schottky barrier diode is reduced.
Public/Granted literature
- US20120228626A1 SEMICONDUCTOR DEVICE AND ITS FABRICATION METHOD Public/Granted day:2012-09-13
Information query
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