Invention Grant
- Patent Title: Light emitting package
- Patent Title (中): 发光包装
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Application No.: US13892814Application Date: 2013-05-13
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Publication No.: US08598601B2Publication Date: 2013-12-03
- Inventor: Jun Seok Park
- Applicant: LG Innotek Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd
- Current Assignee: LG Innotek Co., Ltd
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2004-0107782 20041217; WOPCT/KR2005/002368 20050721
- Main IPC: H01L29/267
- IPC: H01L29/267
Abstract:
The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.
Public/Granted literature
- US20130240941A1 LIGHT EMITTING PACKAGE Public/Granted day:2013-09-19
Information query
IPC分类:
