Invention Grant
- Patent Title: High voltage LDMOS device
- Patent Title (中): 高压LDMOS器件
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Application No.: US13577360Application Date: 2011-04-28
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Publication No.: US08598658B2Publication Date: 2013-12-03
- Inventor: Jian Fang , Lvyun Chen , Wenchang Li , Chao Guan , Qiongle Wu , Wenbin Bo , Zehua Wang
- Applicant: Jian Fang , Lvyun Chen , Wenchang Li , Chao Guan , Qiongle Wu , Wenbin Bo , Zehua Wang
- Applicant Address: CN Sichuan
- Assignee: University of Electronic Science and Technology of China
- Current Assignee: University of Electronic Science and Technology of China
- Current Assignee Address: CN Sichuan
- Agency: Pearne & Gordon LLP
- Priority: CN201010523281 20101028
- International Application: PCT/CN2011/073437 WO 20110428
- International Announcement: WO2012/055225 WO 20120503
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08

Abstract:
A high voltage lateral double diffused metal-oxide-semiconductor field effect transistor (LDMOS) comprises a substrate; an epitaxy layer on the substrate; a drift region on the epitaxy layer; and a drain region and a source region at two ends. At least one pair of n-type and p-type semiconductor regions is arranged alternately above the interface of the substrate and the epitaxy layer and firmly attached to a lower surface of the drifting region; the n-type and p-type semiconductor regions are firmly closed to each other and arranged to form a lateral PN junction; and the p-type semiconductor region and the drifting region form a vertical PN junction. The n-type and p-type semiconductor regions are also totally called “a reduced surface field (RESURF) layer in body”, and the LDMOS device with a RESURF layer in body effectively solves conflict between raising reverse withstand voltage and reducing forward on-resistance of the current LDMOS devices.
Public/Granted literature
- US20130214355A1 HIGH VOLTAGE LDMOS DEVICE Public/Granted day:2013-08-22
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