Invention Grant
- Patent Title: Die pad package with a concave portion in the sealing resin
- Patent Title (中): 密封树脂中具有凹部的模焊垫包装
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Application No.: US13206172Application Date: 2011-08-09
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Publication No.: US08598693B2Publication Date: 2013-12-03
- Inventor: Kenji Nishikawa
- Applicant: Kenji Nishikawa
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2010-178900 20100809; JP2011-110778 20110517
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/00

Abstract:
A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the first side, respectively, is formed in the one plane of the sealing resin. Here, a depth of the concave portion is equal to or greater than a height of the outermost edge of the central structure.
Public/Granted literature
- US20120032316A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MOLD, AND SEALING DEVICE Public/Granted day:2012-02-09
Information query
IPC分类: