Invention Grant
US08598693B2 Die pad package with a concave portion in the sealing resin 有权
密封树脂中具有凹部的模焊垫包装

Die pad package with a concave portion in the sealing resin
Abstract:
A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the first side, respectively, is formed in the one plane of the sealing resin. Here, a depth of the concave portion is equal to or greater than a height of the outermost edge of the central structure.
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