Invention Grant
- Patent Title: Composite substrate for a semiconductor chip
- Patent Title (中): 半导体芯片用复合基板
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Application No.: US13128960Application Date: 2009-11-09
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Publication No.: US08598705B2Publication Date: 2013-12-03
- Inventor: Jürgen Moosburger , Peter Stauβ , Andreas Plöβl
- Applicant: Jürgen Moosburger , Peter Stauβ , Andreas Plöβl
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102008057348 20081114; DE102009007625 20090205
- International Application: PCT/DE2009/001500 WO 20091109
- International Announcement: WO2010/054618 WO 20100520
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A composite substrate for a semiconductor chip includes a first covering layer containing a semiconductor material, a second covering layer, and a core layer arranged between the first covering layer and the second covering layer, wherein the core layer has a greater coefficient of thermal expansion than the covering layers.
Public/Granted literature
- US20110233784A1 COMPOSITE SUBSTRATE FOR A SEMICONDUCTOR CHIP Public/Granted day:2011-09-29
Information query
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