Invention Grant
- Patent Title: Bump-on-trace structures in packaging
- Patent Title (中): 包装上的凸起结构
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Application No.: US13310459Application Date: 2011-12-02
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Publication No.: US08598715B2Publication Date: 2013-12-03
- Inventor: Chih-Hua Chen
- Applicant: Chih-Hua Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A package component includes a metal trace on a top surface of the package component, and an anchor via underlying and in contact with the metal trace. The anchor via is configured not to conduct currents flowing through the metal trace.
Public/Granted literature
- US20130140689A1 Bump-on-Trace Structures in Packaging Public/Granted day:2013-06-06
Information query
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