Invention Grant
- Patent Title: Electrostatic end effector apparatus, systems and methods
- Patent Title (中): 静电末端执行器装置，系统和方法
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Application No.: US12684733Application Date: 2010-01-08
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Publication No.: US08599531B2Publication Date: 2013-12-03
- Inventor: Satish Sundar , Jeffrey C. Hudgens , Prudhvi R. Chintalapati , William Nixon Taylor, Jr. , William P. Laceky , Jeffrey A. Brodine , Dean C. Hruzek , Mario Dave Silvetti
- Applicant: Satish Sundar , Jeffrey C. Hudgens , Prudhvi R. Chintalapati , William Nixon Taylor, Jr. , William P. Laceky , Jeffrey A. Brodine , Dean C. Hruzek , Mario Dave Silvetti
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/673 ; H01L21/677
Abstract:
Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.
Public/Granted literature
- US20100178139A1 ELECTROSTATIC END EFFECTOR APPARATUS, SYSTEMS AND METHODS Public/Granted day:2010-07-15
Information query
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