Invention Grant
- Patent Title: Semiconductor laser manufacturing method and semiconductor laser
- Patent Title (中): 半导体激光制造方法和半导体激光
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Application No.: US13482606Application Date: 2012-05-29
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Publication No.: US08599894B2Publication Date: 2013-12-03
- Inventor: Shunsuke Nozu
- Applicant: Shunsuke Nozu
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Foley & Lardner LLP
- Priority: JP2011-121541 20110531
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
Provided are a semiconductor laser manufacturing method and a semiconductor laser with a low device resistance. First, an active layer is deposited above a GaN substrate of a first conductivity type. A first guide layer made of GaN of a second conductivity type is deposited above the active layer. An AlN layer is deposited on the first guide layer. An opening is formed in the AlN layer. A first cladding layer made of a group-III nitride semiconductor of the second conductivity type is formed on the AlN layer and the first guide layer exposed through the opening such that a first growth rate at a start of growth on the first guide layer exposed through the opening becomes greater than a second growth rate at a start of growth on the AlN layer. A contact layer of the second conductivity type is formed on the first cladding layer.
Public/Granted literature
- US20120307854A1 SEMICONDUCTOR LASER MANUFACTURING METHOD AND SEMICONDUCTOR LASER Public/Granted day:2012-12-06
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