Invention Grant
- Patent Title: Socket connector packaging
- Patent Title (中): 插座连接器包装
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Application No.: US13195010Application Date: 2011-08-01
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Publication No.: US08602255B2Publication Date: 2013-12-10
- Inventor: Yong-Jun Song , Yong-Zhao Huang
- Applicant: Yong-Jun Song , Yong-Zhao Huang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110108713 20110428
- Main IPC: B65D43/24
- IPC: B65D43/24

Abstract:
A socket connector packaging includes a main body and a cover. The main body includes a first sidewall and a pivot positioned on the first sidewall. The cover includes a second sidewall, a coupling portion and a stop portion. The coupling portion and the stop portion are positioned on the second sidewall and opposite to each other. The pivot is placed over the coupling portion, thereby making the cover to be rotatable relative to the main body through the pivot. The stop portion is configured for preventing the cover from further rotating when the pivot contacts with the stop portion.
Public/Granted literature
- US20120273511A1 SOCKET CONNECTOR PACKAGING Public/Granted day:2012-11-01
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