A system for heated gas fusing of toner on non-porous substrates is provided. The system uses (1) an extended fusing zone held at lower temperatures than needed for a roll nip or radiant fuser, and (2) a very low melt toner which can be fused at greatly reduced temperatures compared to conventional toners. In one form, the system is realized through (a) the use of heated gas as the low temperature extended zone fusing technology, and (b) the use of ultra-low melt (ULM) toner—which requires significantly reduced temperature compared to conventional toner. On non-porous packaging substrates the use of heated gas can limit the substrate temperature to 100° C.