A method of manufacturing an electronic component, which includes arranging a plurality of first electrode pads on a first substrate, and a plurality of second electrode pads on a second substrate, so that the first and second electrode pads correspond to each other. The method further includes forming a plurality of solder bumps on the second electrode pads and putting the first substrate over the second substrate. The first and second substrates are shifted in parallel to each other, in a horizontal direction, while the solder bumps are melting, so that the solder bumps are stretched in a slant direction to cause the solder bumps to be solidified into hourglass-shapes.