Invention Grant
- Patent Title: Method of manufacturing a printed circuit board having micro strip line
- Patent Title (中): 具有微带线的印刷电路板的制造方法
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Application No.: US13621122Application Date: 2012-09-15
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Publication No.: US08607448B2Publication Date: 2013-12-17
- Inventor: Heung-Kyu Kim
- Applicant: Heung-Kyu Kim
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0087265 20080904
- Main IPC: H01K3/10
- IPC: H01K3/10

Abstract:
A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.
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