Invention Grant
- Patent Title: Methods of forming a photolithography reticle
- Patent Title (中): 形成光刻掩模版的方法
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Application No.: US13443440Application Date: 2012-04-10
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Publication No.: US08609305B2Publication Date: 2013-12-17
- Inventor: Jin Choi , Jin-Ha Jeong , Urazaev Vladimir , Hea-Yun Lee
- Applicant: Jin Choi , Jin-Ha Jeong , Urazaev Vladimir , Hea-Yun Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2011-0043452 20110509
- Main IPC: G03F1/78
- IPC: G03F1/78 ; G03F1/80

Abstract:
In a method of forming a reticle and electron beam exposure system, first electron beams are irradiated onto a first region of a blank reticle having a light shielding layer and a photosensitive layer, to form first shot patterns. Second electron beams having a cross-sectional area larger than the first electron beams are irradiated onto a second region of the blank reticle. The photosensitive layer is developed to form first and second mask patterns at the first and second regions, respectively. The light shielding layer is etched off using the first and second mask patterns as an etching mask, thereby forming the mother pattern including a first pattern in the first region and a second pattern in the second region. Accordingly, the enlargement of the second electron beams reduces the scan time for the blank reticle, thereby reducing the process time.
Public/Granted literature
- US20120288787A1 Beam Exposure Systems and Methods of Forming a Reticle Using the Same Public/Granted day:2012-11-15
Information query
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