Invention Grant
- Patent Title: Two-by-two pixel structure in an imaging system-on-chip
- Patent Title (中): 成像系统芯片中的2×2像素结构
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Application No.: US13397740Application Date: 2012-02-16
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Publication No.: US08610810B2Publication Date: 2013-12-17
- Inventor: Joey Shah , Laurent Blanquart
- Applicant: Joey Shah , Laurent Blanquart
- Applicant Address: US CA Westlake Village
- Assignee: AltaSens, Inc.
- Current Assignee: AltaSens, Inc.
- Current Assignee Address: US CA Westlake Village
- Agency: Turocy & Watson, LLP
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/335

Abstract:
The claimed subject matter provides systems and/or methods that facilitate mitigating an impact resulting from mismatch between signal chains in a CMOS imaging System-on-Chip (iSoC) sensor. Two-by-two pixel structures can be a basic building block upon which a pixel array is constructed. Further, each two-by-two pixel structure can be associated with a read bus that carries a sampled signal to a top end and a bottom end of a chip. Moreover, multiplexers at either end of the chip can select a subset of the read buses from which to receive a subset of the sampled signals. Accordingly, pixels in a first color plane can be read, processed, etc. on the same side of the chip (e.g., utilizing a common signal chain), while pixels in at least one second color plane can be read, processed, etc. on the other side of the chip (e.g., employing a differing signal chain).
Public/Granted literature
- US20120147229A1 TWO-BY-TWO PIXEL STRUCTURE IN AN IMAGING SYSTEM-ON-CHIP Public/Granted day:2012-06-14
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