Invention Grant
- Patent Title: Power supply structure of a multi-power-supply system
- Patent Title (中): 多电源系统的电源结构
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Application No.: US13243513Application Date: 2011-09-23
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Publication No.: US08611071B2Publication Date: 2013-12-17
- Inventor: Chun-Lung Su , Yi-Wen Lin
- Applicant: Chun-Lung Su , Yi-Wen Lin
- Applicant Address: TW New Taipei
- Assignee: Zippy Technology Corp.
- Current Assignee: Zippy Technology Corp.
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H02B1/26
- IPC: H02B1/26 ; H02B1/20

Abstract:
A power supply structure of a multi-power-supply system which is electrically connected to at least one power supply to get an output power provided by the power supply. The multi-power-supply system includes a power integration back panel and a casing. The power integration back panel is electrically connected to a DC output port and has at least one output cord to receive the power provided by the power supply. The casing has a housing compartment to hold the power integration back panel, an opening for loading the power supply into the housing compartment, and at least one partition to divide the housing compartment to form a space to hold the power supply, a wiring space threaded through by the output cord, and a power supply port exposed outside the surface of the casing to electrically connect to the output cord.
Public/Granted literature
- US20130077209A1 POWER SUPPLY STRUCTURE OF A MULTI-POWER-SUPPLY SYSTEM Public/Granted day:2013-03-28
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