Invention Grant
- Patent Title: Method of manufacturing bonded member and bonded member manufacturing apparatus
- Patent Title (中): 制造接合构件和接合构件制造装置的方法
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Application No.: US12981648Application Date: 2010-12-30
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Publication No.: US08613823B2Publication Date: 2013-12-24
- Inventor: Takayuki Suzuki , Tomoyuki Saito , Masahiro Nakamura
- Applicant: Takayuki Suzuki , Tomoyuki Saito , Masahiro Nakamura
- Applicant Address: JP Tokyo
- Assignee: Origin Electric Company, Limited
- Current Assignee: Origin Electric Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Squire Sanders (US) LLP
- Priority: JP2010-076277 20100329
- Main IPC: B32B37/00
- IPC: B32B37/00

Abstract:
It can prevent extension of the time required for bonding, even when relatively large members are bonded. a bonded member manufacturing apparatus comprises a first holder 11 for holding a first member D, a second holder 12 for holding a second member E, an application device 40 for applying the intermediate substance G to a first bonded surface Df, a moving device 20 for moving the first holder 11 and/or the second holder 12, and a controller. The controller controls the first holder 11, the second holder 12 and the moving device 20 so that a first extended plane De and a second extended plane Ee are arranged such that the first extended plane De and the second extended plane Ee oppose each other in parallel and such that a range where the first bonded surface Df overlaps with the second bonded surface Ef is equal or smaller than a predetermined range when viewed in a direction of the thickness, and then so that the first member D is moved relatively to the second member E in a direction that the range where the first bonded surface Df overlaps with the second bonded surface Ef gradually increases when viewed in the direction of the thickness while maintaining a distance between the first extended plane De and the second extended plane Ee.
Public/Granted literature
- US20110232827A1 METHOD OF MANUFACTURING BONDED MEMBER AND BONDED MEMBER MANUFACTURING APPARATUS Public/Granted day:2011-09-29
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