Invention Grant
- Patent Title: Liner-free tungsten contact
- Patent Title (中): 无衬里钨触点
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Application No.: US13299573Application Date: 2011-11-18
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Publication No.: US08614106B2Publication Date: 2013-12-24
- Inventor: Christian Lavoie , Ahmet S. Ozcan , Filippos Papadatos
- Applicant: Christian Lavoie , Ahmet S. Ozcan , Filippos Papadatos
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Isaac J. Gooshaw; Jason H. Sosa
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A liner-less tungsten contact is formed on a nickel-tungsten silicide with a tungsten rich surface. A tungsten-containing layer is formed using tungsten-containing fluorine-free precursors. The tungsten-containing layer may act as a glue layer for a subsequent nucleation layer or as the nucleation layer. The tungsten plug is formed by standard processes. The result is a liner-less tungsten contact with low resistivity.
Public/Granted literature
- US20130127058A1 LINER-FREE TUNGSTEN CONTACT Public/Granted day:2013-05-23
Information query
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