Invention Grant
US08614445B2 Alkylsilane laminate, production method thereof and thin-film transistor 有权
烷基硅烷层压体,其制造方法和薄膜晶体管

  • Patent Title: Alkylsilane laminate, production method thereof and thin-film transistor
  • Patent Title (中): 烷基硅烷层压体,其制造方法和薄膜晶体管
  • Application No.: US13322830
    Application Date: 2010-05-27
  • Publication No.: US08614445B2
    Publication Date: 2013-12-24
  • Inventor: Takashi KushidaHiroyoshi Naito
  • Applicant: Takashi KushidaHiroyoshi Naito
  • Applicant Address: JP Osaka
  • Assignee: Teijin Limited
  • Current Assignee: Teijin Limited
  • Current Assignee Address: JP Osaka
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2009-129173 20090528; JP2009-129190 20090528
  • International Application: PCT/JP2010/059032 WO 20100527
  • International Announcement: WO2010/137664 WO 20101202
  • Main IPC: H01L29/04
  • IPC: H01L29/04
Alkylsilane laminate, production method thereof and thin-film transistor
Abstract:
Provided is an alkylsilane laminate with which it is possible to obtain an organic semiconductor film having excellent semiconductor properties. Such a laminate can be useful for an organic thin-film transistor. The alkylsilane laminate comprises an underlayer (Sub) having hydroxyl groups at the surface and an alkylsilane thin film (AS) formed on this underlayer. The alkylsilane laminate is a laminate wherein the critical surface energy Ec of the alkylsilane thin film and the number of carbons (X) of the alkylsilane satisfies the following formula (1): Ec≦29.00−0.63x (mN/m) (1) Also provided is a thin-film transistor (10) having such an alkylsilane laminate (Sub, AS).
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