Invention Grant
US08614758B2 Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus 有权
固态成像装置,其制造方法,其驱动方法和电子装置

  • Patent Title: Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus
  • Patent Title (中): 固态成像装置,其制造方法,其驱动方法和电子装置
  • Application No.: US12695316
    Application Date: 2010-01-28
  • Publication No.: US08614758B2
    Publication Date: 2013-12-24
  • Inventor: Hideo Kanbe
  • Applicant: Hideo Kanbe
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Dentons US LLP
  • Priority: JP2009-025346 20090205
  • Main IPC: H04N5/335
  • IPC: H04N5/335
Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus
Abstract:
A solid-state imaging device including: a substrate; a substrate voltage supply that applies a first potential to the substrate during a light receiving period and applies a second potential to the substrate during a no-light receiving period; and a plurality of pixels including a light receiving portion that generates signal charges in response to received light, a storage capacitor that stores and holds the signal charges, a dark current suppressing portion, an electronic shutter adjusting layer that adjusts potential distribution in a substrate so that the signal charges are swept to the rear surface side of the substrate, a readout gate portion that reads out the signal charges stored in the storage capacitor, and a vertical transfer register that transfers the signal charges read out by the readout gate portion in a vertical direction.
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