Invention Grant
- Patent Title: Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus
- Patent Title (中): 固态成像装置,其制造方法,其驱动方法和电子装置
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Application No.: US12695316Application Date: 2010-01-28
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Publication No.: US08614758B2Publication Date: 2013-12-24
- Inventor: Hideo Kanbe
- Applicant: Hideo Kanbe
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2009-025346 20090205
- Main IPC: H04N5/335
- IPC: H04N5/335

Abstract:
A solid-state imaging device including: a substrate; a substrate voltage supply that applies a first potential to the substrate during a light receiving period and applies a second potential to the substrate during a no-light receiving period; and a plurality of pixels including a light receiving portion that generates signal charges in response to received light, a storage capacitor that stores and holds the signal charges, a dark current suppressing portion, an electronic shutter adjusting layer that adjusts potential distribution in a substrate so that the signal charges are swept to the rear surface side of the substrate, a readout gate portion that reads out the signal charges stored in the storage capacitor, and a vertical transfer register that transfers the signal charges read out by the readout gate portion in a vertical direction.
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