Invention Grant
- Patent Title: Compact form factor integrated circuit card and methods
- Patent Title (中): 紧凑型外形尺寸集成电路卡及方法
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Application No.: US13440911Application Date: 2012-04-05
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Publication No.: US08620271B2Publication Date: 2013-12-31
- Inventor: Tang Yew Tan , Jason Sloey , Jared Kole , Naushad Zaveri
- Applicant: Tang Yew Tan , Jason Sloey , Jared Kole , Naushad Zaveri
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: H04M1/66
- IPC: H04M1/66
Abstract:
A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.67 mm (+0.03/−0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
Public/Granted literature
- US20120289196A1 COMPACT FORM FACTOR INTEGRATED CIRCUIT CARD AND METHODS Public/Granted day:2012-11-15
Information query
