Invention Grant
- Patent Title: Nodal modular support surface
- Patent Title (中): 节点模块化支撑面
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Application No.: US11866602Application Date: 2007-10-03
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Publication No.: US08621693B2Publication Date: 2014-01-07
- Inventor: Charles Curtis Wyatt , Kenneth Scott Siegner , Lydia B. Biggie
- Applicant: Charles Curtis Wyatt , Kenneth Scott Siegner , Lydia B. Biggie
- Applicant Address: US CA Los Angeles
- Assignee: Anodyne Medical Device, Inc.
- Current Assignee: Anodyne Medical Device, Inc.
- Current Assignee Address: US CA Los Angeles
- Agency: Nixon & Vanderhye P.C.
- Main IPC: A47C27/08
- IPC: A47C27/08
Abstract:
A support surface includes a plurality of interconnected node groups, where each node group includes at least two nodes connected by a fluid passage. The plurality of interconnected node groups define a node array. A source of pressurized fluid, such as pressurized air is connected with the node array.
Public/Granted literature
- US20080078033A1 Nodal Modular Support Surface Public/Granted day:2008-04-03
Information query
